In dual NVIDIA announced the GeForce GTX Titan Z GK110 flagship card later, AMD also launched immediately double Hawaii's Radeon R9 295X2 flagship card, the time seems to be followed by NVIDIA's walking, in fact, more structure is a natural evolution of Hawaii, unlike technology showcase nature NVIDIA, AMD is released while the product can provide samples to test media, and is scheduled for April 21 officially listed.
R9 290X technology evolution ︰ W9100 and 295X2
Since AMD shipped in Q4 last year, "Hawaii" architecture R9 290X and 290 graphics card, after two quarters of time to accumulate the user experience and make improvements, the results of application of the two "Hawaii" in the framework of a new generation of top products, respectively is FirePro W9100 and Radeon R9 295X2, although both were at launch time on April 7 and 8 are very similar, but because of the different for the market, so in the technological development of extremes.
Merely technical nature show announced NVIDIA GeForce GTX Titan Z preemptive
NVIDIA GTC 2014 Conference held in March just published equipped with two 28nm process "GK110" B1 Stepping graphics core from the GeForce GTX Titan Z graphics card, built a total of 5,760 CUDA Cores, card containing up to 12GB GDDR5 memory provides 8 TeraFLOPS computing performance, and price up to $ 2,999 for a market price gesture of attention, but it is currently only available on paper released without formal. The other hand do not let opponents of natural beauty professionals, respectively, in April 7th and the 8th since the publication FirePro W9100 and Radeon R9 295X2, with a view to rival a high.
Let us talk about FirePro W9100, which uses a single-core design, but a new record of providing entrepreneurial sector 16GB GDDR5, full play the advantages of Hawaii 512bit memory architecture. This is also the author expected, earlier than R9 290X review article, the author has said that the public version R9 290X using 16 64M x 32 GDDR5 particles provide a 4GB capacity, the future if the switch 128M x 32 GDDR5 8GB particles can provide even higher capacity (see http://www.hkepc.com/10278/page/6 # View ).
Now W9100 by the Clamshell mode GDDR5 support 32 128M x 32 GDDR5 composed 16GB GDDR5 capacity, ideal for real-time 4K work for massive memory capacity needs, particularly while using six 4K monitor workplace. However, Clamshell mode requires the x32 bus each group is divided into two x16 bus to support twice as many memory chips, will affect the overclocking capability, so its application is limited to the professional graphics card overclocking does not require such a work environment.
FirePro W9100's 16GB GDDR5 memory is fully demonstrated excellent core memory architecture Hawaii.
AMD Latin "MELIUS EST ERGO DUOS ESSE SIMUL OUAM" as the theme, which means that a good two to one.
Another Ultimate version "Hawaii" is the Radeon R9 295X2 game graphics card, mainly because it is the flagship technology show limited class products, so are spared no expense to make, providing Ultimate Fantasy-class specifications.
Earlier rumors said that because R9 290X power consumption of up to 250W TDP, so AMD will build an inferior race one of R9 290 dual-core flagship graphics card. But as the Radeon HD 7990 and the second best is no problem because the power consumption using the Radeon HD 7950 core, AMD also adhere to the full two R9 290X 4GB graphics card specification to create a top-level products, but also further enhance the core clock to 1018MHz, performance R9 290X is slightly higher than the single-core 1GHz, so the actual performance R9 295X2 expected over R9 290X CrossFire.
The consequences of high specification, forced to use water-cooled!?
AMD pursuit Ultimate specifications result, the power consumption of their work is the equivalent of two R9 290X, TDP power consumption reached a record total of 250W x 2 = 500W. In contrast, the previous generation Radeon HD 7990 is 375W, Radeon HD 6990 is 400W. Interestingly, NVIDIA GeForce GTX Titan Z-power is maintained at a standard 375W, eventually dynasty frequency approach to compliance in unknown, but it is certain that this generation of AMD and NVIDIA's flagship product parted ways. Of course R9 295X2 relaxed to 500W TDP AMD also made to eat crab, not only R9 295X2 Z can be listed on the Titan, and 500W TDP standards will also help increase the product yield, so R9 295X2 able to USD1499 price listed, priced at only half USD2999 for the Titan Z's.
Faced with high power consumption 500W TDP, AMD this is also very decisive, the first use of water cooling in the public version of the graphics card. R9 295X2 is necessary if water-cooled as well? Assuming R9 295X2 using the previous generation Radeon HD 7990 dual-slot 3 fan radiator, the cooling performance is about 450W, taking into account the three fan design makes every fan's size can not be larger than 9cm, then had to use a thicker fans, such as 15mm more fans to higher CFM exhaust volume to increase the amount of heat dissipation efficiency. The result is occupied by three graphics cards require PCI-E slot, while working noise and a significant increase, contrary to the principles of today's products pursuit mute.
The R9 295X2 using American Asetek designed specifically for AMD integrated water cooling system. When it comes to water cooling, there are ad hoc style solutions and integrated solutions, integrated programs, though not as good as the performance of ad hoc style program, but because of security, simplicity and ease of use features and become vendors bundle choice. The adoption of Asetek water cooling AMD products have been used for the ASUS and PNY. The following description of the way in picture function ︰ radiator
Using two separate waste heat generated during Water Block away the GPU.
To 120 x 120 x 25mm to 38mm thick cold exhaust heat, fan speed 1200RPM + / -10% Idle, 2000RPM + / -10% Full Load.
Another card is a 9cm 9 blade fan and power supply components GDDR5 heat.
Light-colored dotted figure is part of AMD recommends installing cold row position.
Radeon R9 290X | Radeon R9 295X2 | Radeon HD 7990 | GeForce GTX Titan Black | |
Core | Hawaii XT | Hawaii XT | Tahiti XT2 | GK110-B1 |
Architecture | GCN | GCN | GCN | Kepler |
Process | 28nm | 28nm | 28nm | 28nm |
Transistors | 6.2 billion | 2x 6.2 billion | 2x 4.31 billion | 7.1 billion |
Die Size | 438mm 2 | 2x 438mm 2 | 2x 365mm 2 | 550mm 2 |
Engine Clock (Boost) | Up to 1GHz | Up to 1018MHz | 950MHz (1000MHz) | 889MHz (980MHz) |
Configuration | 44 Compute Units | 44 Compute Units | 2x 32 Compute Units | 15 SMX |
ALU | 2816 | 2x 2816 | 2x 2048 | 2880 |
Texture Units | 176 | 2x 176 | 2x 128 | 240 |
ROPs | 64 | 2x 64 | 2x 32 | 48 |
Single Precision (GFLOPS) | 5632 | 11470 | 8192 | 5121 |
Double Precision (GFLOPS) | 1408 | 2868 | 2048 | 1300 |
Pixel Fillrate (Gpixels / s) | 64 | 2x 65 | 2x 30.4 | 42.1 |
Texture Fillrate (GTexels / s) | 176 | 2x 179 | 2x 124.9 | 213 |
L2 Cache | 1MB | 2x 1MB | 2x 768KB | 1.5MB |
Memory Type | 512bit GDDR5 | 512bit GDDR5 | 384bit GDDR5 | 384bit GDDR5 |
Memory Size | 4GB | 2x 4GB | 2x 3GB | 6GB |
Memory Date Rate | 5.0Gbps | 5.0Gbps | 6.0Gbps | 7.0Gbps |
Memory Bandwidth | 320GB / s | 2x 320GB / s | 2x 288GB / s | 336GB / s |
PCI-Express | 3.0 | 3.0 | 3.0 | 3.0 |
Maximum Wattage | 250W | 500W | 375W | 250W |
Power Connectors | 6 +8- pin | 2x 8-pin | 2x 8pin | 6 +8- pin |
DirectX * | 11.2 | 11.2 | 11.1 | 11.2 |
OpenGL | 4.3 | 4.3 | 4.3 | 4.4 |
GPGPU | OpenCL 2.0 | OpenCL 2.0 | OpenCL 1.2 | CUDA, OpenCL 1.1 |
Reference Board Display Outputs | DisplayPort, HDMI, DL-DVI-I, DL-DVI-D | 4x mDP, DL-DVI-D | 4x mDP, DL-DVI-I | DisplayPort, HDMI, DL-DVI-I, DL-DVI-D |
Maximum Monitors Output | 4 (6 w / MST) | 5 (6 w / MST) | 5 (6 w / MST) | 4 |
No comments:
Post a Comment